Intel targets India for a new $3.3 billion factory that will make the base substrates for its next generation of chips
Intel is investing $3.3 billion in a new semiconductor substrate manufacturing facility in India, partnering with 3D Glass Solutions, Inc. to construct the plant in Odisha’s Bhubaneswar-Khurda region. The facility will produce high-density interconnect substrates and advanced packaging glass core substrates—foundational components used to attach semiconductor elements like compute and graphics tiles to modern processors and accelerators.
Construction is expected to take approximately six years, with the completed facility projected to create around 1,800 jobs in the surrounding region. This investment represents Intel’s strategic effort to diversify its global manufacturing operations and reduce supply chain concentration. India’s developing semiconductor ecosystem and supportive investment policies have made the country an attractive location for advanced manufacturing infrastructure expansion.
The substrate manufacturing capability is crucial for next-generation chip packaging and interconnect technology, supporting Intel’s continued competitiveness in processor and accelerator design.