Big chipmakers are already committed to using ASML’s next-generation production technology by as soon as 2028
ASML, the world’s sole manufacturer of extreme ultraviolet (EUV) lithography equipment, has secured major commitments from leading chipmakers to adopt its latest High NA EUV technology. Samsung plans to deploy these advanced machines for volume manufacturing by 2028, with TSMC following by 2030.
High NA EUV (High Numerical Aperture Extreme Ultraviolet) represents the cutting edge of semiconductor fabrication technology. Already in use by Intel and SK Hynix, the technology enables faster production and improved yields by simplifying the chipmaking process and eliminating certain production steps. This results in denser wafers with more efficient manufacturing.
Beyond the adoption of High NA EUV systems, ASML is collaborating with Samsung, TSMC, Nvidia, and Apple on a complementary transition from 6-inch to 12-inch photomasks. This expansion of photomask size represents another significant step forward in chip production capacity and efficiency.